Assembly plan should cover : calculation on amount of members and joints , assembling equipments ' choosing , assembly flow sequence , assembly method , progression plan , personnel management , steel members mobilization , quality standards , safety measures and special construction techniques 編制的組織設(shè)計的內(nèi)容應(yīng)包括:計算構(gòu)件和連接件的數(shù)量,選擇吊裝機(jī)械、確定流水程序、確定吊裝方法、制定進(jìn)度計劃、確定勞動組織、規(guī)劃鋼構(gòu)件進(jìn)場、確定質(zhì)量標(biāo)準(zhǔn)、安全措施和特殊施工技術(shù)等。
Currently , the technique of semiconductor laser arrays and stacks assembly is not mature in china . there are no assembling equipment for semiconductor laser arrays and stacks in the world , and all institutions manufacturing semiconductor laser arrays and stacks kept usage of solder as secret . consequently , assembling technique , solder and assembling equipment have been deemed as focal points of my studies 目前國內(nèi)對半導(dǎo)體激光器列陣及疊陣的組裝技術(shù)還不成熟,國內(nèi)外還沒有用于半導(dǎo)體激光器列陣及疊陣的組裝設(shè)備,各個研制半導(dǎo)體激光器列陣及疊陣的機(jī)構(gòu)對焊料的使用還互相保密,因此本人對半導(dǎo)體激光器的結(jié)構(gòu)、組裝技術(shù)、焊料、組裝設(shè)備進(jìn)行了如下研究:對無鋁半導(dǎo)體激光器的結(jié)構(gòu)進(jìn)行了設(shè)計,在理論上對半導(dǎo)體激光器列陣及疊陣進(jìn)行了研究。